Skip to content
Please enter a keyword to search

  • MIL-PRF-55681 Revision G:2016

    Current The latest, up-to-date edition.

    CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

    Available format(s):  PDF

    Language(s): 

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    2. APPLICABLE DOCUMENTS
    3. REQUIREMENTS
    4. VERIFICATION
    5. PACKAGING
    6. NOTES
    APPENDIX A - EQUIVALENT SERIES RESISTANCE MEASUREMENT CRITERIA
                 FOR HIGH FREQUENCY CAPACITOR STYLES CDR11 THROUGH CDR14
                 AND CDR21 THROUGH CDR25
    APPENDIX B - PROCEDURE FOR QUALIFICATION INSPECTION
    APPENDIX C - VISUAL INSPECTION CRITERIA

    Abstract - (Show below) - (Hide below)

    Specifies the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors.

    General Product Information - (Show below) - (Hide below)

    Committee FSC 5910
    Development Note Supersedes MIL C 55681 (D) (07/2001)
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    18/30373170 DC : 0 BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
    MIL-STD-1580 Revision B:2003 DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
    MIL-PRF-55681-4 Revision H:2015 CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY)
    DSCC 09027 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210
    DSCC 05007 : F CAPACITORS, FIXED, CERAMIC, CHIP, 1206
    MIL-PRF-83531 Revision D:2014 DELAY LINES, PASSIVE, GENERAL SPECIFICATION FOR
    DSCC 91019 : K CAPACITOR, FIXED, CERAMIC, CHIP, .56 [MU]F THROUGH 1 [MU]F
    DSCC 14005 : 0 CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0508
    DSCC 09023 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201
    DSCC 88013 : G DELAY LINES, PASSIVE, 3-PIN, SIP
    DSCC 06019 : B CAPACITOR, FIXED, CERAMIC, CHIP, HIGH FREQUENCY
    DSCC 05006 : F CAPACITORS, FIXED, CERAMIC, CHIP, 0805
    DSCC 03029 : E CAPACITOR, FIXED, CERAMIC, CHIP, 0402
    DSCC 94006 : D CAPACITORS, FIXED, CERAMIC, CHIP
    DSCC 05002 : G CAPACITOR, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
    DSCC 05003 : E CAPACITOR, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP
    DSCC 09026 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805
    DSCC 05001 : F CAPACITOR, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
    NASA MSFC STD 3012 : 2012 ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
    DSCC 89089 : C CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE
    DSCC 09025 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603
    MIL-PRF-38535 Revision K:2013 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
    DSCC 84035 : D DELAY LINES, PASSIVE, 10-TAP, DUAL-IN-LINE, 16-PIN
    DSCC 09024 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402
    DSCC 06022 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY
    IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
    PD IEC/TS 62668-2:2016 Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources
    MIL-HDBK-198 Revision B:2012 CAPACITORS, SELECTION AND USE OF
    DSCC 03028 : E CAPACITORS, FIXED, CERAMIC, CHIP, 0603
    DSCC 14004 : 0 CAPACITOR, FIXED, LOW INDUCTANCE, CERAMIC, CHIP, 0306

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-202-211 Base Document:2015 METHOD 211, TERMINAL STRENGTH
    MIL-STD-202-302 Base Document:2015 METHOD 302, INSULATION RESISTANCE
    MIL-STD-202-210 Base Document:2015 METHOD 210, RESISTANCE TO SOLDERING HEAT
    MIL-STD-202-305 Base Document:2015 METHOD 305, CAPACITANCE
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    MIL-STD-202-107 Base Document:2015 METHOD 107, THERMAL SHOCK
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    MIL-STD-202-106 Base Document:2015 METHOD 106, MOISTURE RESISTANCE
    MIL-STD-202-301 Base Document:2015 METHOD 301, DIELECTRIC WITHSTANDING VOLTAGE
    IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
    MIL-STD-790 Revision G:2011 ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS
    MIL-STD-202-104 Base Document:2015 METHOD 104, IMMERSION
    MIL-STD-202-103 Base Document:2015 METHOD 103, HUMIDITY (STEADY STATE)
    MIL-STD-202-108 Base Document:2015 METHOD 108, LIFE (AT ELEVATED AMBIENT TEMPERATURE)
    MIL-STD-202-208 Base Document:2015 METHOD 208, SOLDERABILITY
    MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
    MIL-STD-690 Revision D:2005 Failure Rate (FR) Sampling Plans and Procedures
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective