MIL STD 750-2 : A
Current
Current
The latest, up-to-date edition.
MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
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Language(s)
English
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FOREWORD
SUMMARY OF REVISION A, CHANGE 2 MODIFICATIONS
1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES
CONCLUDING MATERIAL
Determines uniform test methods for the mechanical testing to determine resistance to deleterious effects of natural elements and conditions surrounding military operations.
| Committee |
FSC 5961
|
| DocumentType |
Standard
|
| Pages |
301
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| MIL-STD-750 Revision F:2011 | Test Methods for Semiconductor Devices |
| MIL-STD-750-1 Revision A:2015 | Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999 |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| ISO 14644-2:2015 | Cleanrooms and associated controlled environments — Part 2: Monitoring to provide evidence of cleanroom performance related to air cleanliness by particle concentration |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| MIL-PRF-19500 Revision P:2010 | Semiconductor Devices, General Specification for |
| MIL-STD-750-1 Revision A:2015 | Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999 |
| MIL-STD-750 Revision F:2011 | Test Methods for Semiconductor Devices |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments — Part 1: Classification of air cleanliness by particle concentration |
| MIL-STD-750-3 Base Document:2012 | Transistor Electrical Test Methods for Semiconductor Devices Part 3: Test Methods 3000 Through 3999 |
| FED-STD-595 Revision C:2008 | Colors Used in Government Procurement (S/S By SAE-AMS-STD-595) |
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
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