NBN EN 60191-6-4 : 2004

Current

Current The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)

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Published date: 12-01-2013

Publisher: Belgian Standards

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1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
   4.1 Ball grid array package (BGA) Type 1 - Ball datum
   4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
   5.1 Datum S pertaining to ball coplanarity
   5.2 Datum A, B
   5.3 Definition of specified dimensions and measuring method
   5.4 Profile of a package edge surface v
   5.5 Mounting height A
   5.6 First stand-off A1
   5.7 Second stand-off A4
   5.8 Ball diameter b
   5.9 Ball center position X
   5.10 Ball coplanarity y
   5.11 Package top flatness y1
Annex ZA: Normative references to international publications
         with their corresponding European publications

Abstract - (Show below) - (Hide below)

Includes requirements for the measuring methods of ball grid array (BGA) dimensions.

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Document Type	Standard
ISBN
Pages
Published
Publisher	Belgian Standards
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
BS EN 60191-6-4:2003	Identical
EN 60191-6-4:2003	Identical
DIN EN 60191-6-4:2004-01	Identical
I.S. EN 60191-6-4:2003	Identical

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