EN 60191-6-4:2003

Current

Current The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Available format(s):

Language(s):

Published date: 10-07-2003

Publisher: European Committee for Standards - Electrical

Pure ENs are not available for sale, please purchase a suitable national adoption

Table of Contents - (Show below) - (Hide below)

1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
   4.1 Ball grid array package (BGA) Type 1 - Ball datum
   4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
   5.1 Datum S pertaining to ball coplanarity
   5.2 Datum A, B
   5.3 Definition of specified dimensions and measuring method
   5.4 Profile of a package edge surface v
   5.5 Mounting height A
   5.6 First stand-off A1
   5.7 Second stand-off A4
   5.8 Ball diameter b
   5.9 Ball center position X
   5.10 Ball coplanarity y
   5.11 Package top flatness y1
Annex ZA: Normative references to international publications
         with their corresponding European publications

Abstract - (Show below) - (Hide below)

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

General Product Information - (Show below) - (Hide below)

Committee	CLC/SR 47D
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

National Adoptions - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 60191-6-4:2003	Identical
UNE-EN 60191-6-4:2003	Identical
NBN EN 60191-6-4 : 2004	Identical
I.S. EN 60191-6-4:2003	Identical
BS EN 60191-6-4:2003	Identical
PN EN 60191-6-4 : 2004	Identical
NEN EN IEC 60191-6-4 : 2003	Identical
NF EN 60191-6-4 : 2003	Identical
DIN EN 60191-6-4:2004-01	Identical
CEI EN 60191-6-4 : 2004	Identical
SN EN 60191-6-4 : 2003	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 60191-6-18:2010	Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
EN 60191-6-18:2010	Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Categories associated with this Standard - (Show below) - (Hide below)

Sub-Categories associated with this Standard - (Show below) - (Hide below)

Sorry this product is not available in your region.

Add To Cart