NBN EN 60539-1 : 2008

1 General
   1.1 Scope
   1.2 Normative references
2 Technical data
   2.1 Units, symbols and terminology
   2.2 Definitions
   2.3 Preferred values
   2.4 Marking
3 Quality assessment procedures
   3.1 General
   3.2 Primary stage of manufacture
   3.3 Structurally similar components
   3.4 Qualification Approval procedures
   3.5 Quality conformance inspection
   3.6 Certified test records of released lots
   3.7 Delayed delivery
   3.8 Release for delivery under qualification
        approval before the completion of Group B
        tests
   3.9 Alternative test methods
   3.10 Unchecked parameters
4 Test and measurement procedures
   4.1 General
   4.2 Standard atmospheric conditions for testing
   4.3 Drying and recovery
   4.4 Visual examination and check of dimensions
   4.5 Zero-power resistance
   4.6 B-value or resistance ratio
   4.7 Insulation resistance (for insulated types
        only)
   4.8 Voltage proof (for insulated types only)
   4.9 Resistance/temperature characteristic
   4.10 Dissipation factor (delta)
   4.11 Thermal time constant by ambient temperature
        change (taua)
   4.12 Thermal time constant by cooling after
        self-heating (tauc)
   4.13 Robustness of terminations (not applicable to
        surface mount thermistors)
   4.14 Resistance to soldering heat
   4.15 Solderability
   4.16 Rapid change of temperature
   4.17 Vibration
   4.18 Bump
   4.19 Shock
   4.20 Free fall (if specified in the detail
        specification)
   4.21 Thermal shock (if specified in the detail
        specification)
   4.22 Climatic sequence
   4.23 Cold (if required by the sectional specification)
   4.24 Dry heat (if required by the sectional
        specification)
   4.25 Damp heat, steady state
   4.26 Endurance
   4.27 Mounting (for surface mount thermistors only)
   4.28 Shear (adhesion) test
   4.29 Substrate bending test
   4.30 Component solvent resistance
   4.31 Solvent resistance of marking
   4.32 Salt mist (if required by the sectional
        specification)
   4.33 Sealing (if required by the sectional
        specification)
Annex A (normative) Interpretation of sampling
        plans and procedures as described in IEC 60410
        for use within the IEC quality assessment system
        for electronic components (IECQ)
Annex B (normative) Rules for the preparation of
        detail specifications for capacitors and
        resistors for electronic equipment
Annex C (informative) Typical examples of mountings for
        measurements of directly heated thermistors
Annex ZA (normative) Normative references to
         international publications with their
         corresponding European publications

Applies to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties.