1 General
1.1 Scope
1.2 Normative references
2 Technical data
2.1 Units, symbols and terminology
2.2 Definitions
2.3 Preferred values
2.4 Marking
3 Quality assessment procedures
3.1 General
3.2 Primary stage of manufacture
3.3 Structurally similar components
3.4 Qualification Approval procedures
3.5 Quality conformance inspection
3.6 Certified test records of released lots
3.7 Delayed delivery
3.8 Release for delivery under qualification
approval before the completion of Group B
tests
3.9 Alternative test methods
3.10 Unchecked parameters
4 Test and measurement procedures
4.1 General
4.2 Standard atmospheric conditions for testing
4.3 Drying and recovery
4.4 Visual examination and check of dimensions
4.5 Zero-power resistance
4.6 B-value or resistance ratio
4.7 Insulation resistance (for insulated types
only)
4.8 Voltage proof (for insulated types only)
4.9 Resistance/temperature characteristic
4.10 Dissipation factor (delta)
4.11 Thermal time constant by ambient temperature
change (taua)
4.12 Thermal time constant by cooling after
self-heating (tauc)
4.13 Robustness of terminations (not applicable to
surface mount thermistors)
4.14 Resistance to soldering heat
4.15 Solderability
4.16 Rapid change of temperature
4.17 Vibration
4.18 Bump
4.19 Shock
4.20 Free fall (if specified in the detail
specification)
4.21 Thermal shock (if specified in the detail
specification)
4.22 Climatic sequence
4.23 Cold (if required by the sectional specification)
4.24 Dry heat (if required by the sectional
specification)
4.25 Damp heat, steady state
4.26 Endurance
4.27 Mounting (for surface mount thermistors only)
4.28 Shear (adhesion) test
4.29 Substrate bending test
4.30 Component solvent resistance
4.31 Solvent resistance of marking
4.32 Salt mist (if required by the sectional
specification)
4.33 Sealing (if required by the sectional
specification)
Annex A (normative) Interpretation of sampling
plans and procedures as described in IEC 60410
for use within the IEC quality assessment system
for electronic components (IECQ)
Annex B (normative) Rules for the preparation of
detail specifications for capacitors and
resistors for electronic equipment
Annex C (informative) Typical examples of mountings for
measurements of directly heated thermistors
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications