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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
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Published date: 12-01-2013
Publisher: Belgian Standards
Foreword1 Scope2 Terms and definitions3 General remarks4 Equipment5 Test procedure6 Failure criteria7 Lot acceptance 8 Detail specification9 Summary
Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
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