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  • BS EN 60749-16:2003

    Current The latest, up-to-date edition.

    Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  24-06-2004

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 Scope
    2 Terms and definitions
    3 General remarks
    4 Equipment
    5 Test procedure
    6 Failure criteria
    7 Lot acceptance
    8 Detail specification
    9 Summary

    Abstract - (Show below) - (Hide below)

    Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

    Scope - (Show below) - (Hide below)

    Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Partially supersedes BS EN 60749 Supersedes 00/203281 DC (07/2003)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes
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