NBN EN 60749-20 : 2010

Current

Current The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

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Published date: 12-01-2013

Publisher: Belgian Standards

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INTRODUCTION
1 Scope and object
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Information to be given in the relevant specification
Annex A (normative) Methods of inspection by acoustic
        tomography
Annex B (informative) Details and descriptions of test method
        on resistance of plastic-encapsulated SMDs to the
        combined effect of moisture and soldering heat
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Abstract - (Show below) - (Hide below)

Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).

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Development Note	Supersedes NBN EN 60749. (04/2004)
Document Type	Standard
ISBN
Pages
Published
Publisher	Belgian Standards
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DIN EN 60749-20:2010-04	Identical
BS EN 60749-20:2009	Identical
I.S. EN 60749-20:2009	Identical
UNE-EN 60749-20:2004	Identical
EN 60749-20:2009	Identical
NF EN 60749-20 : 2010	Identical

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