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  • BS EN 60749-20:2009

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    Available format(s):  Hardcopy, PDF

    Superseded date:  14-10-2020

    Language(s):  English

    Published date:  31-01-2010

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 General description
    4 Test apparatus and materials
    5 Procedure
    6 Information to be given in the relevant specification
    Annex A (informative) - Details and descriptions of test
            method on resistance of plastic encapsulated SMDs
            to the combined effect of moisture and soldering
            heat
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Defines a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).

    Scope - (Show below) - (Hide below)

    IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
    - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
    - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
    - update for lead-free solder;
    - correct certain errors in the original Edition 1.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes BS EN 60749. (09/2005) Supersedes 07/30168484 DC. (01/2010)
    Document Type Standard
    Publisher British Standards Institution
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
    IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
    IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
    EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
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