• NBN EN 61192-1 : 2004

    Current The latest, up-to-date edition.


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    Published date:  12-01-2013

    Publisher:  Belgian Standards

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    Table of Contents - (Show below) - (Hide below)

    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 General requirements
        4.1 Order of precedence
        4.2 Process control
        4.3 Facilities
        4.4 Process identification
    5 Pre-process activities
        5.1 Design checks
        5.2 Specification and procurement of components
        5.3 Specification and procurement of printed boards
        5.4 Specification and procurement of process materials
        5.5 Inspection plan, inspection facilities and handling
        5.6 Storage and kitting of components, boards and materials
        5.7 Handling during assembly, packaging and shipping
        5.8 Electrical testing
    6 Component preparation
        6.1 Lead and termination solderability
        6.2 Lead forming
        6.3 Lead flattering
        6.4 Lead cropping
        6.5 Lead coplanarity
        6.6 Thermal shock during re-tinning
        6.7 Moisture and gas traps
    7 Mounting structure and printed board preparation
        7.1 Surface preparation
        7.2 Temporary masking requirements
        7.3 Gold on printed surface-mount lands
        7.4 Printed board condition
    8 Surface-mount solder paste deposition
        8.1 Description of process
        8.2 Storage and handling of solder paste
        8.3 Screen (off-contact) printing
        8.4 Stencil (in-contact) printing
        8.5 Syringe dispensing
        8.6 Transfer deposition of solder performs
    9 Non-conductive adhesive deposition and curing
        9.1 Stencil printing
        9.2 Syringe dispensing
        9.3 Pin transfer printing
        9.4 Adhesive curing
    10 Surface-mounted component placement
        10.1 Leadless discrete components with metallized
        10.2 Leadless circular cylinder components, for example,
              metal electrode leadless faces (MELFs)
        10.3 Leaded discrete small component packages
        10.4 Leaded integrated circuit packages
        10.5 Leaded 'fine-pitch' integrated circuit packages
        10.6 Modified leaded through-hole packages
        10.7 Leadless chip carrier packages
        10.8 Placement equipment
    11 Through-hole component insertion
        11.1 General
        11.2 Axial lead components (two-leads)
        11.3 Radial lead components (two-leads)
        11.4 Radial lead components (three or more leads)
        11.5 Multilead integrated circuit packages
        11.6 Pin grid array (PGA) components
        11.7 Surface mount packages modified for insertion
        11.8 Large components
        11.9 Insertion methods and equipment
        11.10 Cutting and clinching leads
    12 Placement of terminals and press-fit pins
        12.1 Attachment of terminals to printed boards
        12.2 Solderability wires and component leads to terminals
    13 Reflow soldering
        13.1 Infrared reflow soldering in pass-through equipment
        13.2 Convection reflow solderability in pass-through equipment
        13.3 Mixed infrared and convection reflow soldering in
              pass-through equipment
        13.4 Vapour phase reflow soldering
        13.5 Laser scan reflow soldering
        13.6 Thermode (hot bar) reflow soldering
        13.7 Hot gas multijet reflow soldering
        13.8 Focused infrared multi-point reflow soldering
    14 Immersion soldering
        14.1 General requirements
        14.2 Wave soldering
        14.3 Drag soldering
        14.4 Hot dip soldering
    15 Individual point soldering
        15.1 Manual soldering with an iron
        15.2 Hot gas pencil reflow soldering
    16 Cleanliness/cleaning
        16.1 Use of 'no clean' fluxes
        16.2 Cleaning materials
        16.3 Cleaning processes
        16.4 Cleanliness assessment
    17 Electrical test
        17.1 In-circuit test
        17.2 Functional test
        17.3 Test probes and probe lands
    18 Rework and repair
        18.1 General
        18.2 Unmarked components
        18.3 Pre-heating printed boards and sensitive components
        18.4 Re-use of removed components
        18.5 Selection of rework tools and equipment
        18.6 Surface-mounted component realignment
        18.7 Adding solder to existing joints
        18.8 Removing excess solder
        18.9 Component removal
        18.10 Component replacement
        18.11 Repair of assemblies returned from the field
    19 Conformal coatings, including solder resist
        19.1 General
        19.2 Conformal protective coating
        19.3 Solder mask coating
    20 Packaging and shipping
        20.1 Materials
        20.2 Mechanical protection
        20.3 Marking/labelling
        20.4 Handling
    21 Training
        21.1 Training of designers, engineers and senior line
        21.2 Training production line personnel

    Abstract - (Show below) - (Hide below)

    Describes requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Belgian Standards
    Status Current
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