IEC 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
EN 61192-4:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES |
IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
EN 61340-5-1:2016/AC:2017-05
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ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
EN 61190-1-1 : 2002
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
IEC 61340-5-1:2016
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Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
IEC 61188-1-1:1997
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES |
IEC 61192-4:2002
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Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
EN ISO 9002:1994/AC:1997
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QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION |
EN 61191-2:2017
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
EN 61189-3:2008
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
IEC 61760-2:2007
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
EN 61191-3:2017
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PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017) |
IEC 61190-1-1:2002
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
IEC 61189-3:2007
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
IEC 61191-1:2013
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
EN 61192-3 : 2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
IEC 61188-5-1:2002
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Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
IEC 60194:2015
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Printed board design, manufacture and assembly - Terms and definitions |
EN 61249-8-8 : 1997
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Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
ISO 9001:2015
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Quality management systems Requirements |
IEC 61191-2:2017
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
ISO 9453:2014
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Soft solder alloys Chemical compositions and forms |
IEC 61191-4:2017
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Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
EN 61760-2 : 2007
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SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
EN 61340-5-2:2001/corrigendum:2001
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ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
EN 61191-1:2013
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
IEC 61249-8-8:1997
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MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
IEC 61192-2:2003
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Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
IEC 61189-2:2006
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
EN 61188-1-1 : 1997
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-1: GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES |
IEC 61190-1-3:2007+AMD1:2010 CSV
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
EN 61191-4:2017
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PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
IEC 61191-3:2017
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |