EN 61192-1:2003

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Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Workmanship requirements for soldered electronic assemblies - Part 1: General

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Withdrawn date: 01-03-2006

Language(s):

Published date: 25-03-2003

Publisher: European Committee for Standards - Electrical

Pure ENs are not available for sale, please purchase a suitable national adoption

Table of Contents - (Show below) - (Hide below)

Introduction
1 Scope and object
2 Normative references
3 Terms and definitions
4 General requirements
    4.1 Order of precedence
    4.2 Process control
    4.3 Facilities
    4.4 Process identification
5 Pre-process activities
    5.1 Design checks
    5.2 Specification and procurement of components
    5.3 Specification and procurement of printed boards
    5.4 Specification and procurement of process materials
    5.5 Inspection plan, inspection facilities and handling
    5.6 Storage and kitting of components, boards and materials
    5.7 Handling during assembly, packaging and shipping
    5.8 Electrical testing
6 Component preparation
    6.1 Lead and termination solderability
    6.2 Lead forming
    6.3 Lead flattering
6.4 Lead cropping
    6.5 Lead coplanarity
    6.6 Thermal shock during re-tinning
    6.7 Moisture and gas traps
7 Mounting structure and printed board preparation
    7.1 Surface preparation
    7.2 Temporary masking requirements
    7.3 Gold on printed surface-mount lands
    7.4 Printed board condition
8 Surface-mount solder paste deposition
    8.1 Description of process
    8.2 Storage and handling of solder paste
    8.3 Screen (off-contact) printing
    8.4 Stencil (in-contact) printing
    8.5 Syringe dispensing
    8.6 Transfer deposition of solder performs
9 Non-conductive adhesive deposition and curing
    9.1 Stencil printing
    9.2 Syringe dispensing
    9.3 Pin transfer printing
    9.4 Adhesive curing
10 Surface-mounted component placement
    10.1 Leadless discrete components with metallized
          terminations
    10.2 Leadless circular cylinder components, for example,
          metal electrode leadless faces (MELFs)
    10.3 Leaded discrete small component packages
    10.4 Leaded integrated circuit packages
    10.5 Leaded 'fine-pitch' integrated circuit packages
    10.6 Modified leaded through-hole packages
    10.7 Leadless chip carrier packages
    10.8 Placement equipment
11 Through-hole component insertion
    11.1 General
    11.2 Axial lead components (two-leads)
    11.3 Radial lead components (two-leads)
    11.4 Radial lead components (three or more leads)
    11.5 Multilead integrated circuit packages
    11.6 Pin grid array (PGA) components
    11.7 Surface mount packages modified for insertion
    11.8 Large components
    11.9 Insertion methods and equipment
    11.10 Cutting and clinching leads
12 Placement of terminals and press-fit pins
    12.1 Attachment of terminals to printed boards
    12.2 Solderability wires and component leads to terminals
13 Reflow soldering
    13.1 Infrared reflow soldering in pass-through equipment
    13.2 Convection reflow solderability in pass-through equipment
    13.3 Mixed infrared and convection reflow soldering in
          pass-through equipment
    13.4 Vapour phase reflow soldering
    13.5 Laser scan reflow soldering
    13.6 Thermode (hot bar) reflow soldering
    13.7 Hot gas multijet reflow soldering
    13.8 Focused infrared multi-point reflow soldering
14 Immersion soldering
    14.1 General requirements
    14.2 Wave soldering
    14.3 Drag soldering
    14.4 Hot dip soldering
15 Individual point soldering
    15.1 Manual soldering with an iron
    15.2 Hot gas pencil reflow soldering
16 Cleanliness/cleaning
    16.1 Use of 'no clean' fluxes
    16.2 Cleaning materials
    16.3 Cleaning processes
    16.4 Cleanliness assessment
17 Electrical test
    17.1 In-circuit test
    17.2 Functional test
    17.3 Test probes and probe lands
18 Rework and repair
    18.1 General
    18.2 Unmarked components
    18.3 Pre-heating printed boards and sensitive components
    18.4 Re-use of removed components
    18.5 Selection of rework tools and equipment
    18.6 Surface-mounted component realignment
    18.7 Adding solder to existing joints
    18.8 Removing excess solder
    18.9 Component removal
    18.10 Component replacement
    18.11 Repair of assemblies returned from the field
19 Conformal coatings, including solder resist
    19.1 General
    19.2 Conformal protective coating
    19.3 Solder mask coating
20 Packaging and shipping
    20.1 Materials
    20.2 Mechanical protection
    20.3 Marking/labeling
    20.4 Handling
21 Training
    21.1 Training of designers, engineers and senior line
          management
    21.2 Training production line personnel
Figures
Tables

Abstract - (Show below) - (Hide below)

Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.

General Product Information - (Show below) - (Hide below)

Committee	CLC/SR 91
Development Note	To be used in conjunction with EN 61192-2, EN 61192-3 & EN 61192-4 (07/2003)
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Withdrawn

National Adoptions - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 61192-1:2003	Identical
NBN EN 61192-1 : 2004	Identical
NF EN 61192-1 : 2003	Identical
NEN EN IEC 61192-1 : 2003	Identical
I.S. EN 61192-1:2003	Identical
PN EN 61192-1 : 2006	Identical
UNE-EN 61192-1:2003	Identical
BS EN 61192-1:2003	Identical
CEI EN 61192-1 : 2004	Identical
DIN EN 61192-1:2003-11	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

I.S. EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
EN 61192-3:2003	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
EN 62137-1-3:2009	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
I.S. EN 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
KTA 3505 : 2015(R2017)	TYPE TESTING OF MEASURING SENSORS AND TRANSDUCERS OF THE INSTRUMENTATION AND CONTROL SYSTEM IMPORTANT TO SAFETY
BS EN 62137-1-3:2009	Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
BS EN 61192-4:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
CEI EN 62137-1-3 : 2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
BS EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
I.S. EN 61192-4:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
I.S. EN 62137-1-3:2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
BS EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
BS EN 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
EN 61192-5 : 2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61192-2:2003	Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-4:2003	Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Standards Referencing This Book - (Show below) - (Hide below)

IEC 61188-5-2:2003	Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
EN 61192-4:2003	Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61340-5-1:2016/AC:2017-05	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61340-5-1:2016	Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 61192-3:2002	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 61188-1-1:1997	Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
IEC 61192-4:2002	Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
EN ISO 9002:1994/AC:1997	QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9002:1994	Quality systems — Model for quality assurance in production, installation and servicing
EN 61189-3:2008	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61760-2:2007	Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EN 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61192-3:2003	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61249-8-8:1997	Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
ISO 9001:2015	Quality management systems — Requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 61760-2:2007	Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EN 61340-5-2:2001/corrigendum:2001	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61249-8-8:1997	Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
IEC 61192-2:2003	Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61188-1-1:1997	Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
EN 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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