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NBN
NBN EN 62258-6 : 2007

NBN EN 62258-6 : 2007

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

Published date

12-01-2013

Publisher

Belgian Standards

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
  5.1 Requirements for bare die with or without added
      connection structures
  5.2 Requirements for minimally-packaged die
  5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

DocumentType
Standard
PublisherName
Belgian Standards
Status
Current

Standards Relationship
DIN EN 62258-6:2007-02 Identical
I.S. EN 62258-6:2006 Identical
EN 62258-6 : 2006 Identical
BS EN 62258-6:2006 Identical

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