DIN EN 62258-6:2007-02
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
Hardcopy , PDF
German
01-01-2007
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
5.1 Requirements for bare die with or without added
connection structures
5.2 Requirements for minimally-packaged die
5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
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