NBN EN 62374-1 : 2010
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS
Published date
12-01-2013
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Specifies a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
DevelopmentNote |
Supersedes NBN EN 62374. (01/2011)
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DocumentType |
Standard
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PublisherName |
Belgian Standards
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Status |
Current
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Supersedes |
Standards | Relationship |
EN 62374-1:2010/AC:2011 | Identical |
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