NEN EN IEC 60068-2-58 : 2015
Current
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
Published date
12-01-2013
Publisher
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Defines procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Identical |
| EN 60068-2-58:2015/A1:2018 | Identical |
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