IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance |
IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 60068-2-20 : 2008
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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
EN 61190-1-1 : 2002
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
ISO 9454-2:1998
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Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
EN 60068-1:2014
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ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013) |
EN 61760-1:2006
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SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 61760-1:2006
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Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
IEC 61760-4:2015
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Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
IEC TR 60068-3-12:2014
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Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile |
EN 61249-2-35 : 2009
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
EN ISO 9454-2 : 2000
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
EN 61191-2:2017
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
IEC 61760-3:2010
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Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering |
EN 61249-2-22 : 2005
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 60068-2-54:2006
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Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
IEC 60068-3-13:2016
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Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
IEC 61190-1-1:2002
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
IEC 60194:2015
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Printed board design, manufacture and assembly - Terms and definitions |
IEC 61249-2-35:2008
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Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
IEC 61191-2:2017
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
IEC 61249-2-22:2005
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Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
EN 61190-1-3:2007/A1:2010
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
J STD 075 : 0
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CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
EN 61190-1-2:2014
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
J STD 020 : D-1
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MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
IEC 60068-2-69:2017
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Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
EN 60194:2006
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PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS |
IEC 61190-1-3:2007+AMD1:2010 CSV
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |