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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
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Published date: 12-01-2013
Publisher: Netherlands Standards
Defines standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
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