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EN 60191-6-12:2011

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Published date

05-08-2011

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: 'Rectangular type' has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised.

Committee
CLC/TC 47X
DevelopmentNote
Supersedes UNE EN 60191-6-12. (07/2014)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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