NEN EN IEC 60191-6-4 : 2003
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
Published date
12-01-2013
Publisher
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Specifies the requirements for the measuring methods of ball grid array (BGA) dimensions.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-4:2003 | Identical |
| EN 60191-6-4:2003 | Identical |
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