NEN EN IEC 60191-6-5 : 2001
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
Published date
12-01-2013
Publisher
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Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid-array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-5:2001 | Identical |
| EN 60191-6-5:2001 | Identical |
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