IEC 60191-6-5:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Hardcopy , PDF
English
27-08-2001
FOREWORD
1 Scope
2 Normative references
3 Definitions
Tables
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
| DevelopmentNote |
Also numbered as BS EN 60191-6-5. (12/2001) Stability Date: 2020. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| CEI EN 60191-6-5 : 2002 | Identical |
| NF EN 60191-6-5 : 2002 | Identical |
| PN EN 60191-6-5 : 2002 | Identical |
| NEN EN IEC 60191-6-5 : 2001 | Identical |
| EN 60191-6-5:2001 | Identical |
| I.S. EN 60191-6-5:2002 | Identical |
| DIN EN 60191-6-5:2002-05 | Identical |
| UNE-EN 60191-6-5:2002 | Identical |
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