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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
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Published date: 12-01-2013
Publisher: Netherlands Standards
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid-array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
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