• NEN EN IEC 60749-16 : 2003

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)

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    Published date:  12-01-2013

    Publisher:  Netherlands Standards

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    Abstract - (Show below) - (Hide below)

    Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

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    Document Type Standard
    Publisher Netherlands Standards
    Status Current
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