• IEC 60749-16:2003

    Current The latest, up-to-date edition.

    Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  17-01-2003

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 Scope
    2 Terms and definitions
    3 General remarks
    4 Equipment
    5 Test procedure
    6 Failure criteria
    7 Lot acceptance (for guidance)
    8 Detail specification
    9 Summary
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC PAS 62171 (04/2003) Stability Date: 2019. (11/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
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