NEN EN IEC 60749-23 : 2004 AMD 1 2011
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
Published date
12-01-2013
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Determines the effects of bias conditions and temperature on solid-state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-23:2004+AMD1:2011 CSV | Identical |
| EN 60749-23:2004/A1:2011 | Identical |
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