NEN EN IEC 60749-25 : 2003
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The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
Published date
12-01-2013
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Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN 60749-25:2003 | Identical |
| IEC 60749-25:2003 | Identical |
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