NEN EN IEC 61188-5-6 : 2003
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
12-01-2013
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Specifies the appropriate size, shape and tolerance of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder points.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61188-5-6:2003 | Identical |
| EN 61188-5-6:2003 | Identical |
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