NEN EN IEC 61189-3 : 2008
Current
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
Published date
12-01-2013
Publisher
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Defines methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61189-3:2007 | Identical |
| EN 61189-3:2008 | Identical |
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