BS EN 62137-4:2014
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Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
BS EN 61192-1:2003
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Workmanship requirements for soldered electronic assemblies General |
BS EN 61190-1-1:2002
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Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
I.S. EN 61192-1:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
BS EN 61191-1:2013
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Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
EN 62326-1:2002
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Printed boards - Part 1: Generic specification |
EN 61189-11 : 2013
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
EN 61189-2:2006
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
EN 62878-1-1:2015
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Device embedded substrate - Part 1-1: Generic specification - Test methods |
I.S. EN 61191-1:2013
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
BS EN 62326-20:2016
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Printed boards Printed circuit boards for high-brightness LEDs |
BS EN 61188-1-2:1998
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Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance |
BS EN 61189-11:2013
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys |
NF EN 61249 8-8 : 1998
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MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
CEI EN 62878-1-1 : 2016
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DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
I.S. EN 62326-20:2016
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PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
I.S. EN 60664-3:2017
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INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
I.S. EN 61249-4-1:2008
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
EN 60664-3:2017
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Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
BS EN 61192-4:2003
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Workmanship requirements for soldered electronic assemblies Terminal assemblies |
BS EN 61249-4-1:2008
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Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability |
I.S. EN 61189-11:2013
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV)) |
BS EN 62326-1:2002
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Printed boards Generic specification |
I.S. EN 61189-5:2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
CEI EN 62326-1 : 2002
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PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
I.S. EN 61249-8-8:1999
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MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
UNE-EN 60664-3:2004
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Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
BS EN 61249-8-8:1997
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Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
BS EN 61189-5:2006
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Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
BS EN 62878-1-1:2015
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Device embedded substrate Generic specification. Test methods |
12/30258453 DC : 0
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BS EN 62368-1 AMD - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - PART 1: SAFETY REQUIREMENTS |
I.S. EN 61189-2:2006
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
I.S. EN 61192-4:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
I.S. EN 62878-1-1:2015
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DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
CEI EN 61249-4-1 : 2010
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
BS EN 60664-3:2017
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Insulation coordination for equipment within low-voltage systems Use of coating, potting or moulding for protection against pollution |
I.S. EN 62326-1:2002
|
PRINTED BOARDS - GENERIC SPECIFICATION |
BS EN 61189-2:2006
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures |
EN 61249-8-8:1997
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Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
EN 61191-1:2013
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 61249-4-1:2008
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Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability |
EN 62326-20:2016
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Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
EN 62137-4:2014/AC:2015
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ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
EN 61192-1:2003
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Workmanship requirements for soldered electronic assemblies - Part 1: General |
EN 61192-4:2003
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Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
EN 61189-5 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
EN 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |