NEN EN IEC 62047-13 : 2012
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
Published date
12-01-2013
Publisher
Defines the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens.
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