NF EN 62047-13 : 2012
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
Published date
12-01-2013
Publisher
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| DevelopmentNote |
Indice de classement: C96-050-13. PR NF EN 62047-13 August 2012. (08/2012)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-13:2012 | Identical |
| EN 62047-13:2012 | Identical |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
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