SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

Published date

12-01-2013

Publisher

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
  5.1 Requirements for bare die with or without added
      connection structures
  5.2 Requirements for minimally-packaged die
  5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

DevelopmentNote	Indice de classement: C96-034-6 PR NF EN 62258-6 December 2005 (12/2005)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
DIN EN 62258-6:2007-02	Identical
I.S. EN 62258-6:2006	Identical
EN 62258-6 : 2006	Identical
IEC 62258-6:2006	Identical
BS EN 62258-6:2006	Identical

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NF EN 62258-6 : 2006

SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

Table of Contents

Abstract

General Product Information

International Equivalents

Category

Subcategory