NF EN IEC 61190-1-3:2018
Current
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Available format(s)
Hardcopy
Language(s)
English - French
Published date
01-03-2018
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61190-1-3:2017 | Identical |
| EN IEC 61190-1-3:2018 | Identical |
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