NF EN IEC 61190-1-3:2018
Current
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Published date
01-03-2018
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This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.
| DocumentType |
Standard
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| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
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| Standards | Relationship |
| IEC 61190-1-3:2017 | Identical |
| EN IEC 61190-1-3:2018 | Identical |
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