NFC 20 758 : 1990
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ENVIRONMENTAL TESTING - TEST Td: SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
01-01-2005
12-01-2013
The object of this test is to provide a standard procedure for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD) (hereinafter referred to as specimens). The procedure uses a solder bath and is applicable only to specimens of products designed to withstand short-term immersion in molten solder.
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
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| Status |
Superseded
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| SupersededBy |
| Standards | Relationship |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Identical |
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