OVE EN IEC 60749-20:2023 08 01
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Available format(s)
Hardcopy
Language(s)
English, German
Published date
01-08-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
| Committee |
TC 47
|
| DocumentType |
Test Method
|
| Pages |
66
|
| PublisherName |
Osterreichisches Normungsinstitut/Austrian Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-20:2020 | Identical |
| IEC 60749-20:2020 | Identical |
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