OVE EN IEC 61190-1-3:2018
Current
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)
Available format(s)
Hardcopy
Language(s)
German - English
Published date
06-10-2018
Important note : Users cannot be edited or removed once added to your Multi user PDF.Dieser Teil von IEC 61190 legt die Anforderungen und Prüfverfahren für Elektroniklote, für flussmittelgefüllte und massive Lote in Form von Barren, Stangen, Stäben und Bändern, Lotpulver und Lotpaste zum Löten von Elektronikprodukten sowie für ¿spezielle¿ Elektroniklote fest.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Osterreichisches Normungsinstitut/Austrian Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 61190-1-3:2018 | Identical |
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