Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)

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Hardcopy

Language(s)

German - English

Published date

06-10-2018

Publisher

Osterreichisches Normungsinstitut/Austrian Standards

€238.20

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Dieser Teil von IEC 61190 legt die Anforderungen und Prüfverfahren für Elektroniklote, für flussmittelgefüllte und massive Lote in Form von Barren, Stangen, Stäben und Bändern, Lotpulver und Lotpaste zum Löten von Elektronikprodukten sowie für ¿spezielle¿ Elektroniklote fest.

DocumentType	Standard
Pages	0
PublisherName	Osterreichisches Normungsinstitut/Austrian Standards
Status	Current

Standards	Relationship
EN IEC 61190-1-3:2018	Identical

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OVE EN IEC 61190-1-3:2018

Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)

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OVE EN IEC 61190-1-3:2018

Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)

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