PD ES 59008-1:2000
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Data requirements for semiconductor die General requirements
Hardcopy , PDF
07-03-2006
English
15-01-2000
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use.
Committee |
EPL/47
|
DocumentType |
Standard
|
Pages |
10
|
PublisherName |
British Standards Institution
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
ES 59008-1 : 1999 | Identical |
ES 59008-6-2 : 2001 | DATA REQUIREMENTS FOR SEMI CONDUCTOR DIE - DATA DICTIONARY |
ES 59008-4-1 : 2000 | DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY |
ES 59008-6-1 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT |
ES 59008-5-2 : 2001 | DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PART 5-2: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE WITH ADDED CONNECTION STRUCTURES |
ES 59008-3 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS |
ES 59008-1 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS |
ES 59008-2 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY |
ES 59008-4-3 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3 - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL |
ES 59008-5-1 : 2001 | DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE |
ES 59008-4-4 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-4: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - ELECTRICAL SIMULATION |
ES 59008-4-2 : 2000 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE : SPECIFIC REQUIREMENTS AND RECOMMENDATIONS HANDLING AND STORAGE |
ES 59008-5-3 : 2001 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE |
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