![header thumbnail](/images/publishers\pkn_cover.gif)
PN EN 60191-6-3 : 2002
Current
Current
The latest, up-to-date edition.
![header thumbnail](/images/publishers\pkn_cover.gif)
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)
Published date
12-01-2013
Publisher
Committee |
TC 292
|
DocumentType |
Standard
|
PublisherName |
Polish Committee for Standardization
|
Status |
Current
|
Sorry this product is not available in your region.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.