Skip to content
Please enter a keyword to search

  • IEC 60191-6-3:2000

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  29-09-2000

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Definitions
    4 Measuring methods

    Abstract - (Show below) - (Hide below)

    IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Also numbered as BS EN 60191-6.3 (09/2005) A Bilingual edition has been published. (01/2013) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    I.S. EN IEC 60191-1:2018 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
    IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective