• Shopping Cart
    There are no items in your cart

PN EN 60191-6-4 : 2004

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)

Published date

12-01-2013

Sorry this product is not available in your region.

Committee
TC 292
DocumentType
Standard
PublisherName
Polish Committee for Standardization
Status
Current

Standards Relationship
IEC 60191-6-4:2003 Identical
EN 60191-6-4:2003 Identical

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.