PN EN 60749-19 : 2005 AMD 1 2010
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
Published date
12-01-2013
Publisher
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| Committee |
TC 60
|
| DevelopmentNote |
AMD 1 2010 is only available in English. (12/2010)
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| EN 60749-19:2003/A1:2010 | Identical |
| IEC 60749-19:2003+AMD1:2010 CSV | Identical |
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