PN EN 60749-23 : 2006 AMD 1 2011
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
Published date
12-01-2013
Publisher
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Finds out the effects of bias conditions and temperature on solid state devices over time.
| Committee |
TC 60
|
| DevelopmentNote |
AMD 1 2011 is only available in English. (07/2011)
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-23:2004+AMD1:2011 CSV | Identical |
| EN 60749-23:2004/A1:2011 | Identical |
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