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PN EN 60749-23 : 2006 AMD 1 2011

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE

Published date

12-01-2013

Finds out the effects of bias conditions and temperature on solid state devices over time.

Committee
TC 60
DevelopmentNote
AMD 1 2011 is only available in English. (07/2011)
DocumentType
Standard
PublisherName
Polish Committee for Standardization
Status
Current

Standards Relationship
IEC 60749-23:2004+AMD1:2011 CSV Identical
EN 60749-23:2004/A1:2011 Identical

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