PN EN 60749-40 : 2012
Current
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The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
Published date
12-01-2013
Publisher
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Provides a procedure to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
| Committee |
TC 60
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| EN 60749-40 : 2011 | Identical |
| IEC 60749-40:2011 | Identical |
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