• EN 60749-40 : 2011

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

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    Language(s): 

    Published date:  02-09-2011

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test equipment
    5 Test procedure
    6 Test method
    7 Summary
    Annex A (normative) - Drop impact test method
            using test rod
    Annex B (informative) - An example of strain gauge
            attachment procedure
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides a procedure to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

    General Product Information - (Show below) - (Hide below)

    Committee SR 47
    Document Type Test Method
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
    EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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