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PN EN 60749-40 : 2012

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE

Published date

12-01-2013

Provides a procedure to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

Committee
TC 60
DocumentType
Standard
PublisherName
Polish Committee for Standardization
Status
Current

Standards Relationship
EN 60749-40 : 2011 Identical
IEC 60749-40:2011 Identical

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