PNE-FprEN 60191-6-19
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Published date
10-08-2010
Publisher
| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| PublisherName |
Asociacion Espanola de Normalizacion
|
| Status |
Current
|
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