SEMI 3D11 : 2014
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TERMINOLOGY FOR THROUGH GLASS VIA AND BLIND VIA IN GLASS GEOMETRICAL METROLOGY
Superseded date
05-10-2020
Superseded by
Published date
06-01-2015
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Specifies clear and commonly accepted definitions of through glass vias (TGV) and to provide a consistent terminology for the understanding and discussion of metrology issues important them.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (12/2014)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Superseded
|
| SupersededBy |
| SEMI 3D16 : 2016 | SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING |
| SEMI E89 : 2007(R2013) | GUIDE FOR MEASUREMENT SYSTEM ANALYSIS (MSA) |
| SEMI P35 : 2006(R2013) | TERMINOLOGY FOR MICROLITHOGRAPHY METROLOGY |
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